UV high-end smart mesh processing equipment Sea Star Technology laser micromachining system main core components using the world's leading manufacturer of laser first company Spectra-Physics 12W high power UV laser can focus on cutting most materials, especially suitable for any high hardness and cutting brittle materials, drilling, scribing. Machine control system using sea-technology projects independently developed "MicroCut" laser control software, supports CCD visual positioning, galvanometer scanning system, XYZ-axis motion platform simultaneously linkage. Low-cost solution Sea Star Technology UCUT head cut or break series for shape cutting, marking support function, high precision, stable quality. Compared with the traditional processing methods compared to methods, saving time mold, do not have the tool, there is no mechanical stress, stable quality, low maintenance costs, helping users reduce time to market, reduce development and operating costs. When the clean production of laser cutting products produced by the vapor evaporated material can be sucked suction device on the device in addition, after the toxic dust filtration system, odor or dust filter, exhaust air can reach the requirements. Diverse range of applications can be applied sapphire broken glass, broken glass reinforced all villages, ceramic materials, semiconductor materials, polymer materials, thin metal, diamond drilling microporous film and other materials and fine cutting. No mechanical stress with narrow pulse ultraviolet laser processing, high frequency, short wavelength and other characteristics, are cold, low thermal influence on the effect of the material, no stress problems to machining, for most materials can be cut, combined with the sea Head-technology patented cutting technology for sapphire and more can be done without breaking the glass chipping, high-speed requirements. Sea close to the user's software system satellite technology independent research and development projects "MicroCut laser control software is a complete customer perspective developed operating software, friendly interface and perfect for shoving rights management, allowing users to more simple and safe .XY precision motion platform using large disposable seamless, with laser and scanning galvanometer precision machining simultaneously, disposable machinable 420mmX420mm range, combined with decades of Taiwanese and Chinese technology equipment and software technology precipitation, mature and stable software technology, a powerful user-friendly user interface, editing functions, you can achieve great graphics automatically or manually cut cut choice. UV laser micromachining system for foundry services to provide more comprehensive services, sea stars mesh technology intends to purchase equipment customers, provide the processing of business school research institutes and small batch production needs of customers, mainly in the range of sapphire glass broken, all materials reinforced glass, ceramic materials, semiconductor materials, polymer materials, thin metal, diamond films, etc. micro drilling, scribing and fine cutting. Chip and brittle material laser drilling, laser cutting glass and silicon chips such brittle materials cutting drilling has been a difficult process loop processing, traditional processing almost can not come in handy, Sea Star Technology Head for such a lot of thought put into brittle materials, cutting out the quality leader in the industry. can be applied to the glass substrate, Pyrex Glass, Quartz, Si Wafer, Sapphire> diamond cutter wheel and Solar Cell Photovoltaic materials and the like, by laser cutting, drilling, scribing and engraving Application materials: sapphire glass, glass, silicon, silicon solar the drilling thickness: 1 mm following processing aperture: sapphire glass 40μm or more processing aperture: Silicon BIOMEDICAL above 250μm chip laser applications processed in accordance with customer design drawing, you can open a high aspect ratio and high accuracy of the pores or micro-flow channel for customers to produce biochips or micro-electromechanical (MEMS), such as the use of micro-machining processes. Application materials: glass, silicon, acrylic, PMMA minimum line width:. 10μm processing aperture: 10μm above the maximum aspect ratio: 1:10 machining accuracy: ± 1μm pore diameter for a variety of laser cutting diamond film CVD film, high hardness easy processing of deposits, diamond knife to UV laser cutting wheels, making way for high precision, easy target traditional processing operations according to customer demand for a variety of shapes for cutting materials village: metals, non-metallic and superhard diamond cut diamond film thickness: 0.2mm following processing aperture: 50μm above position accuracy: 5μm or less soft board laser cutting and laser drilling, cutting soft plate appearance (Flex Circuit Laser Routing) application is the use of ultraviolet laser Polyimide materials wavelength absorption good, both tangential thin, non-thermal effects, low processing contaminated properties, and is not restricted tools, machining fast response time, cut by drawing directly into the machine, dramatically shortening the time to send samples mold for a short time sample production. The drilling thickness: 0.3 mm following processing aperture: 30μm or more machining accuracy: ± 3μm aperture position accuracy: 5μm ITO laser scribing laser processing within a touch screen used in industry, mainly in the ITO engraved lines, such as indium tin oxide (Indium Tin Oxide, ITO ), the use of laser etching to remove the conductive layer can be made according to customer demand circuit cutting, suitable for high-precision and high-density lines. Application materials: ITO, TCO on broken glass or PET line width: 10μmX10μm position accuracy; 10μm within a variety of ceramic substrate ceramic laser scribing laser cutting (laser cutting), laser scribing (laser scribing), various types of sintered ceramic or low-temperature co-fired ceramics, such as alumina, zirconia, aluminum nitride, boron nitride, LTCC, LED ceramic substrate, the substrate cooling power components such as cutting and scribing, UV laser processing linewidth, high precision, suitable for all kinds of needs high-precision applications. Suitable materials: AL2O3, AIN, SiC, BN, Green Tape, and other ceramic materials Diamond cutting thickness: 0.5mm thickness with an underscore: 2mm following processing aperture: 60μm or more ceramic materials currently used in laser processing of laser drilling probe card Probe Card, Characteristics of the industry for the production of Probe Card Guiding Plate, laser micromachining with ultraviolet (UV Laser Micromachining), the ceramic material (including silicon nitride, silicon carbide, aluminum nitride, etc.) on the production of fine pores. Application materials: SiC, Si3N4, AIN and other materials diamond cutting thickness: 0.5mm following processing aperture: 60μm above taper: 0.5 degree precision: ± lμm aperture position accuracy: 5 | μm or less